bga ball grid array造句

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ball grid array (bga) Recently , designers developed a new type of package : ball grid array ( bga ) package . the bga package has many i / o pins . because of this merit , this kind of package is used widely n...
ball grid array Ball grid array ( BGA ) packages have existed since the 1970s. The x704 was packaged in a 356-ball ball grid array ( BGA ). It was packaged in a 432-ball enhanced ball grid array ( EBGA )....
cbga ceramic ball grid array Cbga ceramic ball grid array
ceramic ball grid array The PA-8800 is packaged in a ceramic ball grid array mounted on a printed circuit board ( PCB ) with the four ESRAMs, forming a module similar to those used by early Itanium microprocessor...
enhanced ball grid array It was packaged in a 432-ball enhanced ball grid array ( EBGA ).
plastic ball grid array It was packaged in a 240-pin plastic ball grid array. The TurboSPARC was packaged in a 416-ball plastic ball grid array ( PBGA ). It was packaged in a 272-ball plastic ball grid array ( BG...
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ceramic column grid array It was packaged in the same 1, 088-column ceramic column grid array as the P2SC, but with a different pin out.
ceramic land grid array It was packaged in a 675-pad flip-chip ceramic land grid array ( CLGA ) measuring 49.53 by 49.53 mm.
ceramic pin grid array The PA-7100LC is packaged in a 432-pin ceramic pin grid array. It is packaged in a 36 mm by 36 mm ceramic pin grid array module which had 201 signal pins. It contained 0.25 million transis...
column grid array It was packaged in the same 1, 088-column ceramic column grid array as the P2SC, but with a different pin out. Major application solutions are provided for rework of small passives, ball g...
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land grid array LGA stands for land grid array. It was packaged in a 1, 200-pad land grid array ( LGA ) package. Surface-mount connections used in RF modules include land grid array ( LGA ) and Castellate...
lga land grid array Lga land grid array
organic pin grid array It distinctively used a ceramic interposer much like the Thunderbird instead of the organic pin grid array package used on all later Palomino processors. The organic pin grid array was ori...
pin grid array It's got the lovely name of Flip-Chip Pin Grid Array, or FC-PGA. The PA-7100LC is packaged in a 432-pin ceramic pin grid array. This is thinner than a pin grid array socket arrangement, bu...
pin grid array package It distinctively used a ceramic interposer much like the Thunderbird instead of the organic pin grid array package used on all later Palomino processors.
plastic pin grid array It was packaged in a 272-ball plastic ball grid array ( BGA ) or 272-pin plastic pin grid array ( PGA ).
bga BGA packages are used to permanently mount devices such as microprocessors. This technique has become standard for packaging DRAMs in BGA packages. At this point, the BGA was in need of re...
bga封装但BGA封装占用基板的面积比较大。注意：TV OUT芯片选用EPSON公司的S1D13746，BGA封装。在BGA封装系列中，CBGA的历史最长。、BGA和微小型BGA封装形式。封装），属于是BGA封装技术的一个分支。 Nano-ITX采用NanoBGA封装的芯片VIA的CN400芯片和Eden处理器。芯片到现在依然还使用传统的BGA封装模式。 2君正soc的引脚...
bga封装模式芯片到现在依然还使用传统的BGA封装模式。的沟通，南桥芯片到目前为止还只能见到传统的BGA封装模式一种。北桥芯片的封装模式最初使用BGA封装模式，到现在Intel的北桥芯片已经转变为FC-PGA封装模式，不过为AMD处理器设计的主板北桥芯片到现在依然还使用传统的BGA封装模式。相比北桥芯片来讲，南桥芯片主要负责和IDE设备、PCI设备、声音设备、网络设备以及其他的I/...
bga封装技术封装），属于是BGA封装技术的一个分支。 Array（小型球栅阵列封装），属于是BGA封装技术的一个分支。对于国内BGA封装技术的开发和应用，希望国家能够予以重视和政策性倾斜。 BGA封装技术又可详分为五大类：1.PBGA（Plasric BGA）基板：一般为2-4层有机材料构成的多层板。除了采用0.18微米制造工艺之外，i845芯片组同时也是第一款使用Flip Chi...
bga焊接笔记本的维修、BGA焊接等手工操作自然不在话下。烙铁焊接、BGA焊接(4台BGA返修台练习)、2天BGA专门训练。在可拆卸BGA焊接点处出现空隙是一种主要的缺陷现象。上海SMT加工，无铅SMT加工，贴片加工，PCB电路板焊接加工，BGA焊接。通过横截面x射线图像的分析，能够对BGA焊接点的质量情况提供定量的SPC测量。可拆卸BGA焊接中的空隙是由于流...